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专利名称：Dual purpose retaining ring and polishing
pad conditioner
发明人：Ron J. Nagahara,Dawn M. Lee申请号：US08/5960申请日：19970717公开号：US06004193A公开日：19991221
摘要：An apparatus is provided for conditioning a polishing pad used for chemical-mechanical polishing. The apparatus comprises the retainer ring used to retain thesemiconductor wafer against the polishing pad. Accordingly, the retainer ring serves adual purpose: to retain the wafer in proper CMP position as well as condition thepolishing surface while polishing of the wafer. The retainer ring includes an inner surfacedefining an opening to receive the semiconductor wafer. Dimensioned radially outside theinner surface is an outer surface. Placed on the distal ends between the inner and outersurfaces is an abrasive surface. The abrasive surface extends along a plane parallel to theretained frontside surface of the wafer. Both the wafer and the abrasive surface contactthe polishing surface either in a rotation about a stationary axis or orbital movementabout that axis. The wafer surface can be pressed to a greater or lesser extent againstthe polishing pad independent of the pressure exerted by the abrasive surface on thatpad radially outside the wafer.
申请人：LSI LOGIC CORPORATION
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