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专利名称：Soft mold and method of fabricating the
same
发明人：Yeon Heui Nam,Jin-Wuk Kim申请号：US11818280申请日：20070614公开号：US08012667B2公开日：20110906
专利附图：
摘要：A soft mold may be manufactured that is used for forming a pattern.
Semiconductor devices and flat panel display devices include a plurality of fine patternson a substrate. The soft mold may be photo-curable and formed of a material with ahydrophobic property similar to heat-curable molds. The photo-curable mold may becreated on a master plate with a resin layer that is removed with a back plate andadhesive layer after embossed or depressed portions are formed on the mold thatcorrespond with embossed or depressed portions of the master plate.
申请人：Yeon Heui Nam,Jin-Wuk Kim
地址：Gangwon-Do KR,Gyeonggi-do KR
国籍：KR,KR
代理机构：Brinks Hofer Gilson & Lione
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