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专利名称：METHOD OF FORMING ENCAPSULATED
SOLID ELECTROCHEMICAL COMPONENT
发明人：Christopher HALLMARK申请号：US13453510申请日：20120423
公开号：US201202735A1公开日：20121101
专利附图：
摘要：A method of forming an encapsulated solid electrochemical componentincludes stacking a first separator, a solid electrochemical component, and a secondseparator on an upper surface of a vacuum plate to form an electrochemical component
assembly, applying a vacuum to the electrochemical component assembly, and applying afirst laser beam around at least part of a circumference of the solid electrochemicalcomponent in the electrochemical component assembly while applying the vacuum tomelt and bond the first and second separators together. The method also includesapplying a second laser beam around the circumference of the solid electrochemicalcomponent in the electrochemical component assembly while applying the vacuum. Thesecond laser beam has a second relatively high power compared to the power of the firstlaser beam such that the first and second separators around the circumference of thesolid electrochemical component are cut.
申请人：Christopher HALLMARK
地址：Joplin MO US
国籍：US
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