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专利名称：Solder powder and method for preparing
the same and solder paste
发明人：Masahiko Hirata,Takashi Ohashi,Hisahiko
Yoshida,Hiroji Noguchi,Takao
Hisazumi,Mamoru Senna,Tetsuhiko Isobe
申请号：US09720722申请日：20001228公开号：US016590B1公开日：20020709
专利附图：
摘要：An organic acid salt is deposited on the surface of a solder powder containing
Sn and Zn. Alternatively, 0.5 to 10 wt. % of a nonionic surfactant is added to a flux. By amethod comprising such a procedure, provided are a lead-free solder powder and solderpaste having good soldering characteristics wherein the reaction of an activatingcomponent with an alloy component in a flux is suppressed.
申请人：MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
代理机构：Merchant & Gould PC
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