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Sensor device and its production method

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专利名称:Sensor device and its production method发明人:古越 亮平,松井 孝憲,今村 徹治申请号:JP2018549606申请日:20180607

公开号:JPWO2018225841A1公开日:20190627

专利附图:

摘要:A sensor device is provided, a vacuum state of the inner space for theequipment that wherein a sensing element is placed can be maintained really. Thesubstrate 20 of one sensor equipment and a The lid component 10 link together via asolder layer 30, and inner space is maintained at vacuum. One engaged mode 14 has in

the land part 14A wherein formed, the central part at four edges of the rectangular endface 10A in a peripheral wall part 12. One land part 14B, region have the smaller widthdimensions W3 of maximum width dimension W2 than land part 14A in addition to the14A of land part; Meanwhile the number of land part and interval therebetween aredefined, so that being made into a fully closed circuit by melting the solder layer 30 thatmultiple solder balls 37 form.

申请人:北陸電気工業株式会社

地址:富山県富山市下大久保3158番地

国籍:JP

代理人:西浦 ▲嗣▼晴,▲高▼見 良貴,出山 匡

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