专利内容由知识产权出版社提供
专利名称:PRINTED CIRCUIT BOARD, AND METHOD
AND APPARATUS FOR DRILLING PRINTEDCIRCUIT BOARD
发明人:Shandang Liu申请号:US14081569申请日:20131115
公开号:US20140093321A1公开日:20140403
专利附图:
摘要:The present invention relates to a method for drilling a printed circuit board,comprising: drilling down in an initial position, and when contacting a live superficial
conductive layer of a PCB, acquiring a first conductive position and acquiring a first heightdifference between the initial position and the first conductive position; drilling onwardafter the first drill bit of the driller drills through the superficial conductive layer andwhen contacting another conductive layer of the PCB, acquiring a second conductiveposition and acquiring a second height difference between the initial position and thesecond conductive position; calculating a difference between the second and the firstheight difference to obtain a third height difference; and performing back-drilling,according to the third height difference, in a position that needs back-drilling. Thepresent invention acquires precise depth information through a test blind via and reducesStub length of back-drilling.
申请人:Huawei Technologies Co., Ltd.
地址:Shenzhen CN
国籍:CN
更多信息请下载全文后查看