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专利名称：Method and device for measuring bond
energy
发明人：Francois Rieutord,Hubert Moriceau,Benoit
Bataillou
申请号：US11666368申请日：20051024公开号：US076846B2公开日：20100330
专利附图：
摘要：The adhesion between two layers, in particular two thin layers of a
microelectronic device, is a data item of importance. It was found that the closure ratio of
the interface could be used, in non-destructive manner, to determine a measurement ofbond energy. A method and a device using a magnitude characteristic of this length aredescribed, in particular using low incidence X-ray reflection and electronic density at theinterface.
申请人：Francois Rieutord,Hubert Moriceau,Benoit Bataillou
地址：Saint Egreve FR,Saint Egreve FR,Ghent BE
国籍：FR,FR,BE
代理机构：Nixon Peabody LLP
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