专利内容由知识产权出版社提供
专利名称：POLISHING APPARATUS
发明人：Toshifumi Kimba,Hiroaki Kusa,Masaki Fujii申请号：US12668065申请日：20080624
公开号：US20110034106A1公开日：20110210
专利附图：
摘要：A polishing apparatus is disclosed. The apparatus includes a stage () configuredto hold a substrate W, a stage-rotating mechanism () configured to rotate the stage, apolishing head () configured to polish a periphery of the substrate held by the stage, acontroller () configured to control operations of the stage (), the stage-rotating
mechanism (), and the polishing head (), an image-capturing device () configured tocapture an image of the periphery of the substrate through at least one terminal imagingelement () arranged so as to face the periphery of the substrate, an image processor ()configured to process the image captured by the image-capturing device, and a liquidejector () configured to eject a light-transmissive liquid toward the periphery of thesubstrate to fill a space between the periphery of the substrate and the terminal imagingelement with the liquid.
申请人：Toshifumi Kimba,Hiroaki Kusa,Masaki Fujii
地址：Tokyo JP,Tokyo JP,Kanagawa-ken JP
国籍：JP,JP,JP
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